untitled
<OAI-PMH schemaLocation=http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd>
<responseDate>2018-01-17T12:16:20Z</responseDate>
<request identifier=oai:HAL:hal-01683194v1 verb=GetRecord metadataPrefix=oai_dc>http://api.archives-ouvertes.fr/oai/hal/</request>
<GetRecord>
<record>
<header>
<identifier>oai:HAL:hal-01683194v1</identifier>
<datestamp>2018-01-15</datestamp>
<setSpec>type:ART</setSpec>
<setSpec>subject:chim</setSpec>
<setSpec>collection:UNIV-AG</setSpec>
<setSpec>collection:CNRS</setSpec>
<setSpec>collection:UNIV-GRENOBLE1</setSpec>
<setSpec>collection:ENSC-MONTPELLIER</setSpec>
<setSpec>collection:IEM</setSpec>
<setSpec>collection:UGA</setSpec>
<setSpec>collection:INPG</setSpec>
<setSpec>collection:INC-CNRS</setSpec>
<setSpec>collection:CHIMIE</setSpec>
<setSpec>collection:UNIV-MONTPELLIER</setSpec>
<setSpec>collection:SIMAP</setSpec>
</header>
<metadata><dc>
<publisher>HAL CCSD</publisher>
<title lang=en>Mechanical properties of hierarchical porous silica thin films: Experimental characterization by nanoindentation and Finite Element modeling</title>
<creator>Jauffrès, David</creator>
<creator>Yacou, Christelle</creator>
<creator>Verdier, Marc</creator>
<creator>Dendievel, Rémy</creator>
<creator>Ayral, Andre</creator>
<contributor>Science et Ingénierie des Matériaux et Procédés (SIMaP) ; Université Joseph Fourier - Grenoble 1 (UJF) - Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP) - Institut National Polytechnique de Grenoble (INPG) - Centre National de la Recherche Scientifique (CNRS) - Université Grenoble Alpes (UGA)</contributor>
<contributor>Institut Européen des membranes (IEM) ; Centre National de la Recherche Scientifique (CNRS) - Ecole Nationale Supérieure de Chimie de Montpellier (ENSCM) - Université Montpellier 2 - Sciences et Techniques (UM2) - Université de Montpellier (UM)</contributor>
<contributor>Chimie des Matériaux - Connaissance et Valorisation (COVACHIMM) ; Université des Antilles et de la Guyane (UAG)</contributor>
<description>International audience</description>
<source>ISSN: 1387-1811</source>
<source>Microporous and Mesoporous Materials</source>
<publisher>Elsevier</publisher>
<identifier>hal-01683194</identifier>
<identifier>https://hal.univ-antilles.fr/hal-01683194</identifier>
<source>https://hal.univ-antilles.fr/hal-01683194</source>
<source>Microporous and Mesoporous Materials, Elsevier, 2011, 140 (1-3), pp.120 - 129. 〈10.1016/j.micromeso.2010.09.004〉</source>
<identifier>DOI : 10.1016/j.micromeso.2010.09.004</identifier>
<relation>info:eu-repo/semantics/altIdentifier/doi/10.1016/j.micromeso.2010.09.004</relation>
<language>en</language>
<subject>[CHIM.MATE] Chemical Sciences/Material chemistry</subject>
<type>info:eu-repo/semantics/article</type>
<type>Journal articles</type>
<description lang=en>Porous thin films considered for applications like separation, sensing and microelectronic have to sustain mechanical stresses during their integration process or in working conditions. Thanks to recent progress in processing methods, it is now possible to precisely control the porosity and combine ordered mesopores with randomly-distributed macropores to achieve hierarchically porous materials. The mechanical properties of thin films containing different types of porosity (ordered meso, random macro and hierarchical) have been investigated by means of nanoindentation. In particular a method recently proposed by Li and Vlassak (H. Li, J.J. Vlassak, Journal of Materials Research 24 (2009) 1114-1126) is applied to account for the substrate effect. Residual indent impressions were imaged by Atomic Force Microscopy (AFM) to provide some insights in the mechanical behavior of the films. In addition, experimental indentation moduli are compared to theoretical predictions obtained via Finite Element (FE) analysis. The different porous structures have been modeled by FE to obtain the effective elastic properties from which the indentation modulus can be inferred. Finally, the experimental-model differences are discussed. © 2010 Elsevier Inc. All rights reserved.</description>
<date>2011-04</date>
</dc>
</metadata>
</record>
</GetRecord>
</OAI-PMH>
